Failure Analysis & Reliability

Failure Analysis & Reliability

QA Department has the capability to perform die-surface failure analysis.  Equipment for environmental and physical reliability testing are also available used for classifying MSL rating and perform stress tests.


Failure Analysis 

  •   Chemical and mechanical decapsulation
  •   Cross-sectioning and polishing
  •   Scanning electron microscopy
  •   Low and high power magnification inspection
  •   X-ray
  •   XRF


Reliability Test

  •   IR reflow
  •   Temperature-humidity (TH) stress testing
  •   Pressure cooker test (PCT)
  •   Scanning acoustic microscopy
  •   Temperature cycle
  •   High temperature storage