Cirtek offers various types of die attach technologies to cater to various needs.
- Epoxy is a standard material and are either conductive or non-conductive.
Epoxies come in varying thermal and electrical conductivities. Epoxy is
- Sintered Ag technology is now being offered to replace AuSn eutectic
solders for cost reason. A version with higher thermal conductivity
that can replace the AuSi eutectic solder will soon be offered.
Sintered Ag is intended for high power application, on the newer SiC and
- Die attach film (DAF) is a replacement for epoxy where bond line
thickness is critical or when die paddle space is a concern. It
is available in either as conductive or non-conductive and comes in
varying thickness (15 to 30 um).
- Au based eutectic perform is still being offered for ceramic packages with